Machine Recycling Discussion and Moderated Newsgroup > Separate Parts
> Electrical Parts
> North
> New
> Tosok GD300 laser chip die bonder year 2000
Tosok GD300 laser chip die bonder year 2000
TOSOKGD300 SEMICONDUCTOR LASER CHIP BONDER
High gas environment / Light bond force
* Oxygen density at bonding point : Less than 100ppm
* Achievable die placement accuracy 5 m
* Light bond force control : 20 100g
* Bond head for higher bond force
* Programmable temperature setting
