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Kla-ade ultragage 9500 wafer metrology tool w/loader ii
KLA-ADE UltraGage 9500 Wafer Metrology Tool w/Loader II
The units are used and in good physical condition.
They could be powered up as shown.
The units were in working condition when we purchased them.
Airmail delivery takes 10-14 days
ADE UltraGage 9500 Wafer Thickness/Flatness Measurement Metrology Tool with a AutoLoader II Wafer Handler for 3" to 8" (200mm)
Specifications are from ADE and may vary slightly due to upgrades, options, or revisions this unit may or may not have.
List Price is: $218,400.00 NEW from ADE (with software which is not included).
The Main Tool's Serial Number Tag Reads:
Power Requirements: 125 VAC, 50-60 Hz
The AutoLoader's Serial Number Tag Reads:
Manufacturer: Irvine Optical Corporation (Now owned by Brooks Automation)
UltraGage 9500 Benchtop Wafer Metrology System:
ADE's UltraGage 9500 is a versatile, multifunctional tool that measures wafer thickness, shape and flatness. High data density, non-contact measurements and fully automated operation make the 9500 an ideal full functional analysis, development and control tool.
Applications include outgoing wafer quality checks at silicon wafer manufacturers, sampling incoming wafer quality at IC fabs, thin film stress measurements and shape of wafers used in thermal processes. Monitor wafer quality in chemical mechanical planarization (CMP) and thin film deposition processes.
Standard on the 9500, real time site flatness measurements are used to qualify wafers for their suitability for lithographic processes. Site size and offset can be varied to qualify the flatness of user specific image layouts, preventing out of specification wafers from entering the IC fabrication process.
Stress (Option May Not Be Included!):
The 9500's optional stress measurement is not sensitive to film type, reflectivity or other optical aberrations found in optically based stress measurement systems. The large number of data points results in highly detailed stress measurements to within 3 mm from the edge. Stress and off-line analysis software can be added eliminating the need to purchase a separate stress measurement tool.
* Post-Polish Wafer Geometry
* 100, 125, 150 and 200mm wafers
* Thickness, flatness, bow, warp
* Bare, filmed, patterned or bumped wafers
* Optional stress measurement (not sure if this is included or software based)
* Optional conductivity type (not sure if this is included or software based)
* SEMI standard measurements
* NIST traceable thickness masters
* Worldwide measurement correlation
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