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10X disco diamond wafer dicing blade zht-989104J-d-T1
10X Disco Diamond Wafer Dicing Blade ZHT-989104J-D-T1
The ZHT-989 series is produced using DISCO's original technology. A combination of an ultra-thin diamond blade and an aluminum hub provides enhanced operation efficiency and stable cutting results. In combination with DISCO's vast application knowledge, these blades provide excellent cutting results when dicing silicon wafers and compound semiconductor wafers such as GaAs.
* Environment-friendly PP (Polypropylene) packaging
